| 摘要 |
A semiconductor device provided with a main body (10) of a rectangular package, many leads (12) protruded therefrom, a heat radiating fin assembly provided on the upper surface of the main body of the package. The assembly comprises a pole (14a) extending upright from the upper surface of the main body of the package, and at least one heat radiating fin (14b) extended from the pole perpendicularly. The heat radiating fins are supported by the direct or indirect engagement with a case (18) containing the semiconductor device. This support is so accomplished that no lead is in contact with anything. Also, when the semiconductor device is so disposed in the case in a predetermined direction, the direction canot be altered. <IMAGE> <IMAGE> |
