| 摘要 |
<p>PURPOSE:To obtain a bonder and a board pressing/securing mechanism in which the productivity can be enhanced by enhancing the operation at the time of switching the type of semiconductor device to be manufactured. CONSTITUTION:A member 176 for pressing the lead frame of a board against a bonding stage is mounted/demounted quickly onto/from a supporting mechanism 178 through engaging means 201, 202, 205, 206.</p> |
