| 摘要 |
PURPOSE:To provide a wire bonding apparatus which forms balls on all pad electrodes in the desired thickness. CONSTITUTION:A wire bonding apparatus comprises a bonding tool for pressing a ball formed at the end part of a bonding wire to a pad electrode of a semiconductor chip, a ball thickness measuring sensor 14 for measuring thickness of the ball which is deformed on the pad electrode and a comparator 17 for outputting a comparison value between the measured value of the ball thickness measuring sensor 14 and preset thickness of ball. When the comparator 17 provides the result that the measured value does not reach the preset value, the ball is further deformed by driving a controller 20 of the driving system. Meanwhile, when the measured value has reached the preset value, the apparatus controller 18 terminate the bonding work is provided. |
