| 摘要 |
PURPOSE:To obtain an inexpensive TAB semiconductor device in which reflow can be performed easily and collectively with other packages. CONSTITUTION:Pads 3 are formed on the outer circumference of a device hole 22 in a TAB tape and an insulating cover resist 7 is applied in order to protect a wiring pattern as shown by a cover resist coating line 5. Inner leads 3 are then connected with a semiconductor chip 4. In order to protect the semiconductor chip 4 and to secure the inner leads 6 and a base film 9 firmly, the cover resist 7 is formed wider than the device hole 22 and the base film 9, as well as the chip, is resin coated. Subsequently, electrode bumps 11 to be bonded to a printed board 13 are formed and separated through cut holes 2 before being connected to OLB pads 12 simultaneously with other types of packages through collective reflow. |
