| 摘要 |
<p>PURPOSE:To obtain a test method which prevents a lead from being deformed and whose testing efficiency is enhanced by a method wherein an IC can be tested while housed in a container. CONSTITUTION:The housing container for a semiconductor device is provided with a housing part for the semiconductor device 4, with opening parts i2 which are formed in positions corresponding to leads for the housed semiconductor device and with protrusions 3 which are formed on a face on the opposite side of a face, on which the housing part has been formed, and which press the leads for the semiconductor device on the lower side when the housing container is stacked. The device is housed in the housing container, a plurality of housing containers are stacked, contact pins 5 are connected to the leads through the opening parts and the semiconductor device is tested.</p> |
