| 摘要 |
PURPOSE:To provide a module board where a heat radiator is to be attached without enlarging the dimension in vertical direction to the surface, and an electronic device which makes possible high-density mounting by narrowing the interval between each module board and the next. CONSTITUTION:A plate-shaped heat radiator 4 made of high heat conductive material such as, for example, Al, or Cu is attached, being extended in the horizontal direction with the surface of a module board 1 by a high heat conductive adhesive such as silicone or rubber, at the bottom of the lower layer of the wiring board 2 of the module board 1. The plate-shaped heat radiator 4 has a main part 4A consisting of plate-shaped parts 4a, 4b, 4c... in plural stages arranged in vertical direction to the surface of the module board 1, at its tip, and this main part 4A is arranged at the side of the module board 1. |
