| 摘要 |
PURPOSE:To lead out the inner wiring terminal to the periphery of a semiconductor chip matching the interval of outer lead, using a conventional production system, even if the inner wiring terminals are arranged at high density in the central part an the surface of the semiconductor chip by fixing a surface wiring layer to the surface of the semiconductor chip through an adhesive layer. CONSTITUTION:The semiconductor device comprises a semiconductor chip 1 having a surface arranged with inner wiring terminals, a wiring layer 3 fixed through an adhesive layer 5 to the surface of the semiconductor chip 1, and outer wiring terminals 4 arranged on the periphery of the semiconductor chip 1. The surface wiring layer 3 has one end part connected electrlically with the inner wiring terminals and the other end part connected electrically with the outer wiring terminals 4. For example, a copper foil TAB lead 3 of 35mum thick has one end thermocompressed to the inner wiring terminal through a gold bump 2 and the other end extending outward from the circumference of the semiconductor chip 1 and thermocompressed to the lead frame 4. The TAB lead 3 is bonded to the surface of the semiconductor chip 1 through the adhesive layer 5. |
