发明名称 SUBSTRATE SUPPORT AND METHOD OF REMOVING FOREIGN MATTER FROM SUBSTRATE
摘要 <p>PURPOSE:To constitute a substrate support for handling, which is used when a foreign body on a substrate is removed by using an adhesive tape, to eliminate a situation that adhesive tapes pasted from the surface and the rear of the substrate support are bonded to each other and to surely paste an adhesive tape on the substrate up to its peripheral edge. CONSTITUTION:A substrate support 1 is provided with a substrate housing hole 2 whose shape is a little larger than the outer shape of a substrate W, and it is constituted of a rigid plate material whose thickness is equal to, or a little larger than, that of the substrate. In addition, a groove 4 one end of which communicates with the substrate housing hole 2 and the other end of which is formed to be a dead end shape is formed in the substrate support 1.</p>
申请公布号 JPH0831915(A) 申请公布日期 1996.02.02
申请号 JP19940182861 申请日期 1994.07.11
申请人 NITTO SEIKI KK 发明人 MATSUSHITA TAKAO;MIYAMOTO SABURO
分类号 B65G49/07;H01L21/304;H01L21/673;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B65G49/07
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