| 摘要 |
PURPOSE:Not to generate cracks in mold resin, not to make a semiconductor chip temperature high even when the semiconductor chip size is increased without increasing a size of a device, and further to facilitate operations in connecting a lead frame to a metal fine wire. CONSTITUTION:In a semiconductor device H having a heatsink 1 in order to prevent a heat-generation of a semiconductor chip 3, a semiconductor chip 3 is mounted on the heatsink 1 and also a lead frame 5 is adhered with adhesives 6 in a state of securing an insulation. The semiconductor chip 3 is connected with the lead frame 5 via a wire 7, and the semiconductor chip 3, the lead frame 5 adhering to the heatsink 1 and the wire 7 are sealed with mold resin 8. |
