| 摘要 |
<p>PURPOSE:To provide a printed circuit board fitted with projections, which can be mounted on a main circuit board and which is small in variation of height of the electrodes, and a semiconductor chip package of BGA structure using it. CONSTITUTION:For this semiconductor chip package, semiconductor chips 10a and 10b are mounted on the front or/and back of a printed circuit board A1 fitted with projections being equipped with an insulating base material 1, where a plurality of projections 2 are made integrally at the back 1b, electrodes 4, which consists of the projections 2 and conductive materials 3 covering them, circuit patterns c1, which are wired on the front or/and back of the insulating material, and conductor circuits 6 (6a and 6b), which connect the electrodes 4 with the circuit patterns c1.</p> |
