| 摘要 |
<p>PURPOSE:To improve heat radiation, strengthen grounding, and reduce noise, by making a plurality of heat radiation lead pins protrude to the outside from the side surface perpendicularly intersecting a rectangular resin member whose surface has a plurality of protruded electrode lead pins. CONSTITUTION:The respective two heat radiation lead pins 12a, 12b and 12c, 12d stretch from a rectangular die pad 11 upward and downward, and the tips of them are retained by the upper frame main body 10a and the lower frame main body 10b. On the left side and the right side of the die pad 11, the respective four electrode lead pins 13a-13b are fixed to the frame main bodies 10a, 10b by tie bars 14a, 14b. An IC chip 20 is die-bonded to the die pad 11 and electrically connected with an electrode pad through electrode pins 13a-13h. The die pad 11, the IC chip 20, the heat radiation lead pins 12a-12d, and the electrode lead pins 13a-13h are unified in one body by using mold resin 30.</p> |
