| 摘要 |
PURPOSE:To provide a device capable of increasing mounting density in an FPC base board having a wiring pattern which conducts a multielectrode terminal connector and each contact of the multielectrode terminal connector. CONSTITUTION:A wiring pattern is formed in only one surface of the front and back surfaces of an FPC base board 10 to extend to both sides about a multielectrode connector 20, and the lead-out parts 12 of the wiring pattern 11 are provided in both end parts of the FPC base board 10. The pair of the lead-out parts 12 of the wiring pattern are made eccentric in the different direction from each other with respect to the center of the extending direction of the FPC base board 10 in the plane state of the the FPC base board 10, and when the FPC base board 10 is folded back about the intermediate part of the extending direction, the pair of the wiring patterns 11 are provided so as to be located in different positions in a plan view and not to be superposed on each other. |
