发明名称 METAL FILM REMOVING AND PROCESSING METHOD AND MANUFACTURE OF PHOTOELECTROMOTIVE ELEMENT
摘要 PURPOSE:To make it possible to fully remove projections around a portion to be processed when removing and processing a metal film by radiating energy beam by first radiating an energy beam to the portion to be processed of the metal film and then radiating a second energy beam having an energy density different from the previous beam. CONSTITUTION:A polymer thin film 10 is formed on a substrate 1, and a metal film 2 comprising A1 or the like is formed on the polymer thin film 10. XeC1 excimer laser beam 4 with the energy density of 0.10J/cm<2> is applied to this metal film 2. By radiating this laser beam 4, a modifying region 2c is formed in the, region to be radiated of the metal film 2. Next, XeCl excimer laser beam 5 having the energy density of 0.90J/cm<2> is applied to the inner region of this modifying region 2c. By the radiation of this laser beam 5, the metal film inside the modifying region 2c is removed, and a removed portion 2b is formed. No significant deformation is recognized in the adjacent region of this removed portion 2b.
申请公布号 JPH0831774(A) 申请公布日期 1996.02.02
申请号 JP19940160300 申请日期 1994.07.12
申请人 SANYO ELECTRIC CO LTD 发明人 SHINOHARA WATARU;YAMAMOTO KEISHO;KIYAMA SEIICHI
分类号 H05K3/08;H01L21/302;H01L31/04 主分类号 H05K3/08
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