| 摘要 |
<p>PURPOSE:To obtain a surface mount structure for electronic device in which the reliability can be enhanced at a joint by preventing generation of voids in the resin and variation in the coefficient of thermal expansion surely. CONSTITUTION:When connection pads 5 on the side of a circuit board, i.e., a printed wiring board 2, are connected through bumps 12 with connection pads 4 on the side of an electronic device, i.e., a bare chip 1, an interface sealing film 3 is interposed between them. The interface film 3 is porovided by making a plurality of through holes 8 at predetermined positions of a filmy basic materila 7 produced by dispersing a filler 6 uniformly into a thermoplastic resin. Respective through holes 8 cohespond to connection pads 5 on the side of a printed wiring board 2. A bare chip1 is thermally compression-bonded with this interface sealing film 3 laid out.</p> |
