| 摘要 |
PURPOSE: To provide a connector of low stature structure and a substrate connecting method for conducting a highly reliable electrical connection between substrates without producing a bend if they are directly pressed in the vertical direction. CONSTITUTION: A connector 210 for a substrate includes a first and a second connectors 220a, 220b each having a contact connected preferably by SMT soldering to lands 261, 262 formed on opposed surfaces of substrates 260a, 260b respectively. A first connector housing has a recess 241 in the longitudinal direction and an interconnection via an elastic connection member 30 is conducted between opposed contact parts of the contact of the second connector 220b and of the contact of the first connector 220a interposed in the recess 241. Preferably, the contacts each are a plating layer formed on a surface of the housing or a conductor pattern of FPC fixed to the housing. |
