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发明名称
MANUFACTURE OF IC PACKAGE
摘要
申请公布号
JPH0832014(A)
申请公布日期
1996.02.02
申请号
JP19940188944
申请日期
1994.07.18
申请人
DAIDO STEEL CO LTD
发明人
YAMADA HIROSHI
分类号
B23K1/08;H01L21/50;H01L21/56;H01L23/50;(IPC1-7):H01L23/50
主分类号
B23K1/08
代理机构
代理人
主权项
地址
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