发明名称 Aluminium tape to lead through connection formation for electrolytic capacitor
摘要 The method initially involves production of a bulge using a suitable tool on the lead-through (1) in the region of the exit point from the termination disk (2). The aluminium tape is subsequently laid on the lead-through and punched out by a stamp having a smaller bore hole diameter than the diameter of the lead-through. A projection (10) is produced by the punching out whose diameter corresponds to the bore hole of the stamp. The part of the projection which projects above the aluminium tape is finally deformed into a rivet head (13).
申请公布号 DE4426807(A1) 申请公布日期 1996.02.01
申请号 DE19944426807 申请日期 1994.07.28
申请人 SIEMENS MATSUSHITA COMPONENTS GMBH & CO. KG, 81541 MUENCHEN, DE 发明人 WETZLER, MARTIN, 89567 SONTHEIM, DE
分类号 H01G9/00;H01G9/008;(IPC1-7):H01G9/00;H01G9/10 主分类号 H01G9/00
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