A surface-mount network device which is to be mounted on a mounting substrate is disclosed. Said device comprises: an insulating substrate having at least one of wirings and passive elements; a plurality of lead terminals which sandwich said insulating substrate from an end face of said insulating substrate; terminal connection conducrors which are formed on the main surfaces of said insulating substrate, said terminal connection conductors connecting said lead terminals and at least one of said wirings and said passive elements; and sealing means for covering at least connecting portions between said terminal connection conductors and said lead terminals; wherein end portions of said lead terminals are bent to extend in a direction substantially parallel to said mounting substrate, and said device is to be mounted vertically on said mounting substrate through said bent end portions of said lead terminals.
申请公布号
DE69024313(D1)
申请公布日期
1996.02.01
申请号
DE1990624313
申请日期
1990.10.19
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., KADOMA, OSAKA, JP