Mfg. method for piezoelectric cavity-type resonance component

摘要

The method enables mfr. of a piezoelectric resonance component. The component has a hollow cavity (12). This is formed around an oscillator electrode (3a,3b) of a piezoelectric resonance element (1). First, an organic silicon connection (10) is provided around the oscillator electrode (3a,3b) of the piezoelectric resonance element (1). A film (11) is then formed around the piezoelectric resonance element (1) and the organic silicon connection (10). The hollow chamber (12) is then formed by dispersing the organic silicon connection outwards through the film (11). An outer covering material (13) is then formed around the film (11). The application of the organic connection (10) pref. includes the step of applying at least a connection of silane, chlorosilane, etc.. The step of applying the film (11) pref. involves applying a UV radiation curable resin (13).