| 发明名称 |
MOLDED PLASTIC SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER |
| 摘要 |
There is provided a molded plastic electronic package (40) having improved thermal dissipation. A thermal dissipator (26'), such as a heat spreader or a heat slug is partially encapsulated in the molding resin (30). The thermal dissipator (26') has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery (44) is approached. |
| 申请公布号 |
WO9602942(A1) |
申请公布日期 |
1996.02.01 |
| 申请号 |
WO1995US08214 |
申请日期 |
1995.06.29 |
| 申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK;TYLER, DEREK, E.;BRADEN, JEFFREY, S.;POPPLEWELL, JAMES, M. |
| 分类号 |
H01L23/28;H01L23/12;H01L23/29;H01L23/31;H01L23/373;H01L23/433 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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