| 摘要 |
<p>There is provided a molded plastic electronic package (40) having improved thermal dissipation. A thermal dissipator (26'), such as a heat spreader or a heat slug is partially encapsulated in the molding resin (30). The thermal dissipator (26') has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery (44) is approached.</p> |
