Wire-fin liquid-cooling body

摘要

The invention relates to a metal liquid-cooling body tailored for cooling semiconductor elements, characterized in that the surface of the liquid duct (liquid channel) has been enlarged by means of metal (usually copper) rectangular spiral-shaped wire fins being disposed in the liquid duct of the cooling body, the wire fins being thermally connected to the cooling body, with the result that greater heat transfer takes place from the cooling body to the liquid than is the case if a bare liquid duct is used.