SEMICONDUCTOR DEVICE, DICING BLADE AND DICING METHOD USING THAT

摘要

PURPOSE:To improve the reliability of semiconductor device by enhancing adhesion strength between semiconductor chip and mold resin. CONSTITUTION:In a semiconductor device 1 having a semiconductor chip 2 with an electric circuit formed on one surface 2a and a mold resin 4 for sealing the semiconductor chip 2 in a state of exposing said circuit forming surface 2a and a chip rear surface 2b at opposite side, the circuit forming surface 2a of the semiconductor chip 2 is formed larger than the rear surface 2b of the chip.