| 摘要 |
PURPOSE:To facilitate position adjustment of respective optical parts and to obtain an integrated optical unit having good environmental resistance by packaging the optical parts on the surface of a substrate for packaging consisting of a silicon wafer having (110) as its uppermost surface by positioning the optical parts respectively in their optical axis direction in perpendicular grooves formed with {111} as their side faces. CONSTITUTION:This optical unit has the substrate 400 for packaging which consists of the silicon wafer 401 having (110) as its uppermost surface and having the perpendicular grooves 405, 406, 407 with the {111} faces as their side faces. The optical unit has a semiconductor laser 101 which is surface-packaged by positioning the laser in, at least, the optical axis direction and emits a luminous flux, a photodetector 111 which receives the return light from an optical recording medium 105 and a forward and backward path separating element 201 which introduces the luminous flux from the semiconductor laser 101 to the optical recording medium 105 side and introduces the return light from the medium 105 to the photodetector 111 side in the perpendicular grooves 405, 406, 407. As a result, the integrated optical unit which facilitates the position adjustment of the optical parts, is reduced in size and thickness and has the excellent environmental resistance is obtd. |
