发明名称 |
Laser diode module and method for fabricating the same |
摘要 |
A thermistor assembly is formed by fixedly attaching a thermistor (6) on to a base (10) formed of a material having good heat conductivity and the thermistor assembly (12) and an LD chip (2) are fixedly attached on to a carrier (4) arranged in contact with an electronic cooling element (8) using brazing materials with different melting points, so that, when, for example, the thermistor is found faulty, the thermistor can be easily exchanged with a good one. <IMAGE> |
申请公布号 |
EP0477841(B1) |
申请公布日期 |
1996.01.31 |
申请号 |
EP19910116209 |
申请日期 |
1991.09.24 |
申请人 |
FUJITSU LIMITED |
发明人 |
MASUKO, TAKAYUKI, C/O FUJITSU LIMITED;SATOH, SHUNICHI, C/O FUJITSU LIMITED;ISHIZAKA, TETSUO, C/O FUJITSU LIMITED |
分类号 |
H01S5/00;G02B6/42;H01S5/02;H01S5/022;H01S5/024;H01S5/042 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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