发明名称 Laser diode module and method for fabricating the same
摘要 A thermistor assembly is formed by fixedly attaching a thermistor (6) on to a base (10) formed of a material having good heat conductivity and the thermistor assembly (12) and an LD chip (2) are fixedly attached on to a carrier (4) arranged in contact with an electronic cooling element (8) using brazing materials with different melting points, so that, when, for example, the thermistor is found faulty, the thermistor can be easily exchanged with a good one. <IMAGE>
申请公布号 EP0477841(B1) 申请公布日期 1996.01.31
申请号 EP19910116209 申请日期 1991.09.24
申请人 FUJITSU LIMITED 发明人 MASUKO, TAKAYUKI, C/O FUJITSU LIMITED;SATOH, SHUNICHI, C/O FUJITSU LIMITED;ISHIZAKA, TETSUO, C/O FUJITSU LIMITED
分类号 H01S5/00;G02B6/42;H01S5/02;H01S5/022;H01S5/024;H01S5/042 主分类号 H01S5/00
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