发明名称 IN MOLD TRANSFER MOLDING METHOD AND MOLDING
摘要 PURPOSE:To reduce the cost by eliminating the waste of a transfer film in the case of a partial transfer by in mold transfer molds. CONSTITUTION:A transfer film 20 having a width size responsive to the width of a part to be desired to be transferred is used in the case of transferring a design to the part of a molded form in which a vessel body is, for example, coupled to the two parts of a cover via hinge. A mold (movable side) 12 of the shape in which the mold surface part 12B and its periphery 12D corresponding to the part to be transferred are deleted in the thickness of the film 20 is used. The film 20 is so inserted as to cover the cavity part and its periphery corresponding to the part to be desired to be transferred, molds 10 are closed, and a molding material is injected.
申请公布号 JPH0825414(A) 申请公布日期 1996.01.30
申请号 JP19940189901 申请日期 1994.07.19
申请人 DAINIPPON PRINTING CO LTD 发明人 ISHIKAWA KOJI
分类号 B29C45/26;B29C45/14;B29C45/16;B29C45/37;B29L9/00;(IPC1-7):B29C45/16 主分类号 B29C45/26
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