| 摘要 |
<p>PURPOSE:To provide a method for integrally molding a circuit board with sufficiently manufacturing cost reduction and high reliability. CONSTITUTION:A circuit board 50 which places an electronic component 51 is installed in a molded space 6A formed between a pair of mold members 1A and 1B, the component 51 is molded by injection molding using thermosetting or thermoplastic resin to form a molded form 60, thereby protecting the component 51 and the board 50. The member 1B is replaced with a forming mold 2, the periphery of the form 60 disposed in a molded space 6B formed between the member 1A and 2 is molded by injection molding using the thermosetting or thermoplastic resin to prevent the damage of the component 51 and the board 50, and then the board 50 is integrally molded.</p> |
