| 摘要 |
PURPOSE:To prevent a crack from occurring on a surface-mounting type package at the time of surface-mounting by taking out the package from a moisture- proof laminate bag and heating and plane-adhering the package to a surface- mounting substrate within three days from take-out. CONSTITUTION:A magazine 2 is received into an interior box 1 made of paper or the like. A surface-mounting type semiconductor package 3 is put in the magazine 2, and protrusion outside the magazine 2 is prevented by a stopper 4. Moisture absorbent 5 is interposed between a wall end of the interior box 1 and a side of the magazine 2. A flange 7 is folded inward the interior box 1 to have a lid 6 closed. Thereafter the interior box 1 is put into a bag 8 for deaeration, while an opening 9 of the bag 8 is heat-sealed. Then an entire package is heated within a week from taking it out of the bag 8. Thus operation for baking the semiconductor package before mounting is eliminated, as well as interface peeling or crack may not occur since the package is taken out of the laminate bag and plane-mounted on the substrate within a week. |
