| 摘要 |
A multi-chip module semiconductor device comprises a base board, at least one first semiconductor device chip mounted on a first surface of the base board, at least one second semiconductor device chip mounted on a second surface of the base board, a first heat dissipating member provided for only the at least one first semiconductor device chip, and a second heat dissipating member provided for only the at least one second semiconductor device chip, independently of the first heat dissipating member. Further, the at least one first semiconductor device chip is preferably mounted through a first thermally insulating structure on the first surface of the base board, and the at least one second semiconductor device chip is preferably mounted through a second thermally insulating structure on the second surface of the base board. Thus, heat generated by the chip mounted through on one surface of the base board, will never influence the chip mounted through on the other surface of the base board. Therefore, the chips can be mounted on opposite surfaces of the base board without the problem of the heat and with an elevated integrated density. |
