GLASS LEAD MOUNTING STYLE SEMICONDUCTOR DEVICE

摘要

a charge coupled device having a plurality of conductive bumps on bond pads of the charge coupled device; an insulating tape having a predetermined thickness and a predetermined width and bonded to inside portions of the conductive bumps on the charge coupled device; and a glass lid having a plurality of metal lines on opposite sides of a lower surface thereof and bonded to an upper surface of the insulating tape on the charge coupled device. The sealing part of a sealing resin is provided between a lower periphery of the glass lid and an upper surface of the charge coupled device. The charge coupled device package reduces the package weight as well as the package the thickness, and achieves the recent trend of lightness and compactness of an integrated camera and video cassette recorder system.