发明名称 MANUFACTURING FOR RESIN SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To provide a resin injection step for a whole-body resin sealed semiconductor device, in which a part of a base board put between holding pins is coated easily with a reliable insulating layer. CONSTITUTION:A given part to be put between holding pins 7 is coated previously with an insulating film 5 so that the holding pin 7 doesn't need removing in a molding resin injecting step. The insulating film 5 can be formed by bonding an insulating film or by impregnating the chip with a liquid resin and hardening the resin.
申请公布号 JPH0823006(A) 申请公布日期 1996.01.23
申请号 JP19940155551 申请日期 1994.07.07
申请人 FUJI ELECTRIC CO LTD 发明人 MARUYAMA ATSUSHI
分类号 H01L21/56 主分类号 H01L21/56
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