摘要 |
PURPOSE:To provide a resin injection step for a whole-body resin sealed semiconductor device, in which a part of a base board put between holding pins is coated easily with a reliable insulating layer. CONSTITUTION:A given part to be put between holding pins 7 is coated previously with an insulating film 5 so that the holding pin 7 doesn't need removing in a molding resin injecting step. The insulating film 5 can be formed by bonding an insulating film or by impregnating the chip with a liquid resin and hardening the resin. |