SURFACE STRUCTURE OF CERAMICS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

A surface structure of a ceramic substrate is capable of suppressing diffusion of Ni to an uppermost Au plating layer. Furthermore, the thickness of the Au plating layer is reduced in accordance with the present invention. In the method of manufacturing the surface structure, a metallized layer, an Ni layer and an Au layer are formed in this order on the surface of a ceramic substrate. The substrate is heated in a non-oxidizing atmosphere to cause an alloying reaction between the Ni layer and the Au layer. Thereafter, the uppermost plating layer is formed on the resulting NiAu alloy layer. Since Ni in the NiAu alloy layer is not easily released, diffusion of Ni into the Au plating layer can be suppressed sufficiently. Therefore, the Au plating layer can be significantly reduced in thickness.