LEAD FRAME, SEMICONDUCTOR DEVICE, AND CIRCUIT DEVICE

摘要

PURPOSE:To provide a semiconductor package excellent in electrical and heat dissipating properties. CONSTITUTION:A semiconductor chip 30 is mounted on a grounding board 26 of a lead frame and electrically connected to inner leads 22a, the grounding board 26, and a power supply board 2 respectively as required, and the semiconductor chip 30 and the tips of the inner leads 22a are sealed up with sealing member 36 so as to make the other surface of the grounding board 26 where no semiconductor chip is mounted and the surface of the power supply board 28 flush with that of the grounding board 26 exposed to serve as connecting sections.