发明名称 METHOD AND APPARATUS FOR CENTERING IC LEAD FRAME
摘要 PURPOSE:To make it possible to position a spacing plate automatically for centering an IC of various types. CONSTITUTION:A top of the axle of screwdriver 2 held by hand is fitted to a driving hole 29 of a socket spanner 25 and pushed to the side of the socket spanner 25 to compress a coil spring 30. The top of the axle is oscillated on a screw bar 7, and a rotating axle 45 pushes the coil spring 30 through compressed force to move a cylindrical part of the rotating axle. Then, the movement is detected by a driving switch 52 and a screw bar 7 is rotated by a servo motor so that spacing plates 16 and 17 are unfolded until the positions are detected by a mechanical origin sensor 24. After this coordinate position is regarded as the mechanical origin, the spacing plates 16 and 17 are moved to positions corresponding a width of an IC stored previously in a spacing position memory.
申请公布号 JPH0823001(A) 申请公布日期 1996.01.23
申请号 JP19940157867 申请日期 1994.06.15
申请人 ISHII KOSAKU KENKYUSHO:KK 发明人 ISHII MITOSHI
分类号 B65G21/20;B23P19/00;H01L21/50;H01L21/68;H01L23/50;H05K13/02;(IPC1-7):H01L21/50 主分类号 B65G21/20
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