发明名称 POLISHING METHOD
摘要 PURPOSE:To effectively grind down only desired protruding parts without generating so-called 'dishing'. CONSTITUTION:Average distance, during grinding, between the surface of the recessed part of a film and the surface of a grinding cloth 22 is set wider than the average grain diameter of grinding grains 31, by adding organic compound wherein at least one hydrophilic group is included and molecular weight is larger than or equal to 100 to grinding liquid 32. The friction coefficient between the film to be ground and the grinding liquid 32 is set larger than that between the grinding cloth and the grinding liquid 32, during grinding.
申请公布号 JPH0822970(A) 申请公布日期 1996.01.23
申请号 JP19940157385 申请日期 1994.07.08
申请人 TOSHIBA CORP 发明人 NOUJIYOU HARUKI;NAKADA RENPEI;KODERA MASAKO;HAYASAKA NOBUO
分类号 B24B37/00;B24B37/07;C09G1/02;C09K3/14;H01L21/304;H01L21/3105 主分类号 B24B37/00
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