| 摘要 |
PURPOSE:To stably perform mounting operations without cracking or damaging electronic parts irrespective of the kinds of electronic parts. CONSTITUTION:When electronic parts A are mounted onto a printed wiring board B, the electronic parts A are vacuum-chucked by using a nozzle body 14 to descend the nozzle body 14, whereby the electronic parts A are pressed to the printed wiring board B. In this embodiment, a descend position of the electronic parts A has beforehand been decided so that the electronic parts A are pressed by a target pressing force that the electronic parts A are not cracked or damaged, and a decision of the descend position is made on the basis of data obtained as a result that a pressure sensor 18 experimentally detects a pressing force acting on the electronic parts A. |
