发明名称 RESIN MOLD
摘要 PURPOSE:To provide a resin mold capable of achieving the miniaturization of a molding machine due to the reduction of mold clamping load. CONSTITUTION:A resin mold 1 is constituted so that the gate parts 13, 23 constituting a gate are formed from a hard alloy having hardness of 1 or more and at least cavity blocks 11, 22 and a center block 12 excepting the gate parts 13, 23 are formed from an alloy other than an iron hard alloy having hardness of 1 or less, for example, an aluminum or copper hard alloy.
申请公布号 JPH0820046(A) 申请公布日期 1996.01.23
申请号 JP19940179495 申请日期 1994.07.06
申请人 SONY CORP 发明人 KOJIMA AKIRA;HAYASHI TSUNEYUKI;FUKAZAWA HIROYUKI;SAITO TAKASHI
分类号 B29C45/26;B29C33/56;B29C45/02;B29C45/14;B29C45/37;B29L31/34;(IPC1-7):B29C45/26 主分类号 B29C45/26
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