SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To provide a semiconductor integrated circuit device, in which flip chip bonding can be carried out with high reliability, by detecting a defect in connection of a metallic bump easily. CONSTITUTION:An electrode connection gold bump 4 is formed on a mounting wiring board 2. A flip chip bonding step is carried out by using the electrode connection gold bump 4 to mount a semiconductor chip. At this time, a dummy gold bump 7 as high as the electrode connection gold bump 4 is formed near the semiconductor chip 6 on the mounting wiring board 2.