摘要 |
<p>PURPOSE:To decrease the number of the components of an external logic circuit and shorten the mounting set time by changing the array of signals of the pins of the package of the microprocessor and the properties of the signals. CONSTITUTION:The silicon wafer 3 of the microprocessor consists of a CPU part 1 and a programmable logic circuit part 2 which surrounds it, and the CPU part 1 inputs and outputs an address signal, a data signal, and a control signal through the programmable logic circuit part 2. This microprocessor inputs and outputs signals from and to the output from the pins of an unillustrated package through the terminal pad 4 (bonding wire connection part) of the logic circuit 2. Then the program contents of the logic circuit part 2 are modified according to purposes.</p> |