| 发明名称 |
HEAT-CONDUCTING ADHESIVE |
| 摘要 |
Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesive resins have high through-the-thickness thermal conductivity. <IMAGE> |
| 申请公布号 |
RU2052483(C1) |
申请公布日期 |
1996.01.20 |
| 申请号 |
SU19914895345 |
申请日期 |
1991.05.06 |
| 申请人 |
E.I.DYUPON DE NEMUR END KOMPANI |
发明人 |
DZHEROM TOMAS ADAMS;BRYUS ALLEN JOST |
| 分类号 |
C09J11/04;C09J9/02;C09J201/00;H01L23/482;H01L23/498;H05K1/02;H05K3/30;(IPC1-7):C09J9/02 |
主分类号 |
C09J11/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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