发明名称 |
SUBSTRATE TREATING DEVICE |
摘要 |
<p>PURPOSE:To reduce floor area for a substrate treating device installation and suppress an increase in the floor area of the substrate treating device due to a large substrate. CONSTITUTION:In a substrate treating device comprising: a centering treating part for performing a centering process for a substrate; a cleaning treating part 6 (or 7) for performing a cleaning process for the substrate treated by the centering treating part 5; a dry treating part 8 for performing a dry process for the substrate treated by the cleaning treating part 6; and a carry robot 9 for carrying the substrate to each treating part, one treating part is arranged in three dimensions on another treating part out of the centering treating part 5 and the dry treating part 8.</p> |
申请公布号 |
JPH0817899(A) |
申请公布日期 |
1996.01.19 |
申请号 |
JP19940147480 |
申请日期 |
1994.06.29 |
申请人 |
HITACHI LTD |
发明人 |
TORII ZENZO;TAMURA NAOYUKI;TSUBONE TSUNEHIKO;NAKADA KENJI |
分类号 |
B23Q17/22;H01L21/02;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
B23Q17/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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