发明名称 SUBSTRATE TREATING DEVICE
摘要 <p>PURPOSE:To reduce floor area for a substrate treating device installation and suppress an increase in the floor area of the substrate treating device due to a large substrate. CONSTITUTION:In a substrate treating device comprising: a centering treating part for performing a centering process for a substrate; a cleaning treating part 6 (or 7) for performing a cleaning process for the substrate treated by the centering treating part 5; a dry treating part 8 for performing a dry process for the substrate treated by the cleaning treating part 6; and a carry robot 9 for carrying the substrate to each treating part, one treating part is arranged in three dimensions on another treating part out of the centering treating part 5 and the dry treating part 8.</p>
申请公布号 JPH0817899(A) 申请公布日期 1996.01.19
申请号 JP19940147480 申请日期 1994.06.29
申请人 HITACHI LTD 发明人 TORII ZENZO;TAMURA NAOYUKI;TSUBONE TSUNEHIKO;NAKADA KENJI
分类号 B23Q17/22;H01L21/02;H01L21/68;(IPC1-7):H01L21/68 主分类号 B23Q17/22
代理机构 代理人
主权项
地址