| 摘要 |
<p>PURPOSE:To provide a structure, wherein the flow of a resin within a metal mold is smooth and the whole sutructure can be uniformly sealed with the resin. CONSTITUTION:An integrated circuit component is constituted into a a structure wherein a chip formed with a circuit is placed on an island 2 and leads 3 and the chip 1 are sealed with resin 5, which is cast in a metal mold, in a state that the leads 3 are coupled with the chip 1 by gold wires 4. When a diagonal line intersecting orthogonally a straight line that links a gate 11 with an air vent 12 is assumed as the boundary between the gate 11 and the air vent 12, the dimension of the island 2 on the side of the gate 11 is the half of a 12-mm square square and the dimension of the island 2 on the side of the air vent 12 is the half of a 15-mm square square. If the circuit component is formed into such a constitution and the dimension of the leads are equal, the gap on the side near the gate 11 out of the gaps between the leads 3, which are used as main flow paths for the resin which flows to the upper side of the chip, and the island 2 becomes wide and the gap on the side far from the gate 11 becomes narrow.</p> |
