| 摘要 |
PURPOSE:To provide, in a semiconductor element having an internal circuit, at least two terminals connected to each other separately from the internal circuit, and connect these terminals to wiring extending outside of a portion facing the semiconductor element on a deposited substrate. CONSTITUTION:The connection resistance of wiring between terminals of a semiconductor element 1 and a deposited substrate 16 can be directly measured with wiring portions 17, 18 of the deposited substrate 16. Thus, it is possible to grasp the degree of margin in the case that the contact resistance is compared with the upper bound of the connection resistance not disturbing normal operation of the semiconductor element 1. Also, when performance of a device having the semiconductor element 1 fails, it is possible to know whether the cause of the failure is in an internal circuit of the semiconductor element 1 or in the connection process of the resistance between the 1. In addition, by production control of the resistance between the terminals, a device which has good device property but may become a defective product in the market can be discriminated. |
