| 摘要 |
PURPOSE:To provide an IC package wherein electromagnetic wave and surge noises can be reduced, while constitution and process are simple and automation is easy. CONSTITUTION:A multilayer capacitor 6 comprising earth electrode layers 32, 33, 35, and 36 formed an a wiring board 2, dielectric layers 41 and 42, and a signal electrode layer 34 is connected between an earth line and an input or output signal line, and further, a semiconductor chip 1 is wrapped roughly with the earth electrode layers 33, 35, and 36 and a metal cap 4. Therefore, electromagnetic wave or surge noises, superposed an the input or output signal line an the outside of a IC package or the wiring within the IC package connected to them by the multilayer capacitor 6, is reduced, and further, since the earth electrode layers 32, 33, 35, and 36 of the multilayer capacitor 6 together with the metal cap 4 wrap the semiconductor chip 1, incident electromagnetic wave noise is reduced. |
