| 摘要 |
<p>PURPOSE: To provide an electrical part packaging for mounting an electrical part on a printed circuit board using the IR reflow soldering technique, and a package-manufacturing method. CONSTITUTION: A forming structure 50 is formed by sealing one portion of a lead frame with a forming compound. A lead 23 projects from one side of the formation structure and one portion of a tab 27 projects from the other side of the formation structure. The formation structure has a cavity 57 between the lead 23 and the tab part 27. In addition, the formation structure has a breathing hole between the leads 23 and an opening reaching the cavity. After a semiconductor chip 64 is mounted in the cavity 57, they are covered with a lid 53, thus forming the part of the lead 23 and that of the tab 27. The tab 27 gives a structural stiffness to the formation structure 50 and at the same time package the surface of the formation structure 50.</p> |
