| 摘要 |
PURPOSE:To enable a mounting head to move stably and a puddle of solder to be stably formed so as to prevent defective soldering. CONSTITUTION:Wirings of conductive metal such as copper or the like are formed into a pattern on a base film 1 rectangular in a plan view and connected to a semiconductor device 2 such as an LSI or the like mounted on the upside of the base film 1. The semiconductor device 2 kept in contact with the base film l is sealed up with a sealing resin 3, and a connection between the semiconductor device 2 and the wirings of the base film 1 is kept high in reliability. The outer terminals 4, 4,... of the wirings are made to protrude like the teeth of a comb from the underside of the base film 1, and a belt-like support, film 5 is fixed to the tips of the outer terminals 4, 4,.... Furthermore, a stripe of support film 6 is fixed between the support film 5 and the base film 1 in parallel with the support film 5. |
