| 摘要 |
PURPOSE:To provide a semiconductor device having excellent heat dissipation capacity by minimizing the thermal resistance value of a heat radiating fin for air-cooled semiconductor device. CONSTITUTION:The fins 3 of a heat radiating fin 1 provided with multiple each of fins 3 externally radiating heat from a heat generating semiconductor element are arranged so that respective intervals of the fins 3 may be arranged to make elevation angles of a1>b1, a2>b2, a3>b3 gradually diminishing in the running direction of an air stream so that the flow rate between the fins 3 may be accelerated to increase the heat dissipation capacity of the heat radiating fin 1. |
