发明名称 THREE-DIMENSIONAL SHAPE DETECTION METHOD FOR SOLDER
摘要 PURPOSE:To accurately detect a three-dimensional solder shape from a single sheet of image information by irradiating solder as a measurement object with illumination light from a light source of multi-stage annular type, and photographing the solder with a camera. CONSTITUTION:A light source 2 is provided in a multi-stage, for example, in four stages, so as to have concentric arrangement and give different irradiation angles along the altazimuth line of a virtual hemisphere about solder 6 as a measurement object. The light source 2 is formed to be annular as a whole. The light source 2 is turned on to irradiate the solder 6, thereby forming circular fringe calescence point images on the surface of the solder 6 under reflected light. A radial density measurement scanning line is determined on the image of calescence points photographed with a camera 4. Furthermore, the inclination angle of a reflection point as a measurement point on the surface of the solder 6 is obtained by establishing correspondence to a density distribution value on the scanning line as well as the graph of preliminarily measured inclination angle-reflection intensity. Thereafter, a distance from the center of the solder 6 to the measurement point and the height thereof are found, on the basis of the inclination angle, thereby detecting the surface contour of the solder 6.
申请公布号 JPH0814849(A) 申请公布日期 1996.01.19
申请号 JP19940165858 申请日期 1994.06.27
申请人 MATSUSHITA ELECTRIC WORKS LTD;NIPPEI TOYAMA CORP 发明人 NAKAGAWA MASAYUKI;NUMATA MUNETOSHI
分类号 G01B11/24;G01N21/88;G01N21/956;G06T1/00;G06T7/00;H05K3/34 主分类号 G01B11/24
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