| 摘要 |
PURPOSE: To provide an electrical and physical joint structure, by connecting a substrate and a pad of an integrated circuit element, through a composite bank which comprises a polymer body and an electrically conductive metallic film which covers the polymer body. CONSTITUTION: A composite bump is formed on an input/output bump 26 of an integrated circuit element 30. This composite bump comprises a single polymer body 32, and an electrically conductive metallic film 36 which covers the polymer body, and includes the solder metal, and the composite bump is brought into contact with the input/output bump 24 of a substrate 20, and is heated, so that the polymer body 32 of low Young's modulus is deformed, and the solder of the film 36 is melted, whereby the electrical and physical composite bump joint structure of the substrate and the integrated circuit element, having high reliability, can be obtained. |
