| 摘要 |
<p>PURPOSE:To prevent damage such as chipping and crack from occurring by placing a plurality of lines of edges on the outer-periphery surface of a braking roller by placing them in peripheral direction at an equal spacing so that they are extended in the direction of the axial line of the breaking roller and then allowing the spacing of each etch to correspond to the spacing of a breaking spare line. CONSTITUTION:A braking roller 14 is formed in a long and narrow hexagonal post shape. Therefore, six lines of edges 15 are placed at the outer periphery of the braking roller 14 according to six ridges of the hexagonal post at an equal spacing in peripheral direction so that they are extended in the direction of axial line of the braking roller 14. Then, a spacing L between the adjacent edges 15, 15 is set so that it is equal to a spacing P of braking spare lines. Also, a relief part 16 is provided in a sectional circular shape and in the groove shape with a constant width and a constant depth being extended in the direction of the axial line. Also, a position deviation compensation device 20 compensates the position deviation between the braking spare line of the semiconductor wafer and the edge.</p> |
